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Recommended Land Pattern
Outline of Substrate
PCB Pad Diameter
Solder Mask Dia = Pad
Diameter +.15mm (.006 inch)
1.27 mm Pitch (B6) = 0.64mm/.025 inch
For .006" Thick Solder Paste Stencil, Aperture Opening
Should be Equal to the PCB Pad Diameter.
Refer to www.ctscorp.com/components/clearone.asp for
additional PCB design information
Mechanical Diagram
L
H
W
RT_300B6
CTS YRWK
A1 Identifier
P (Pitch)
K
P (Pitch)
D
1.27mm Pitch
L
W
H
P
D
K
RT1300B6
RT2300B6
mm
Inch
11.43 ± 0.15
.450 ± .006
5.08 ± 0.15
.200 ± .006
1.32 ± 0.15
.052 ± .006
1.27 ± 0.25
.050 ± .010
0.76 ± 0.05
.030 ± .002
0.64 ± 0.25
.025 ± .010
Complete ClearONE Product, Processing, and Application Information can be found at the following link:
http://www.ctscorp.com/components/clearone.asp
? 2006 CTS Corporation. All rights reserved. Information subject to change.
CTS Electronic Components
www.ctscorp.com
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LVD SCSI Terminator
March 06
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